Plastic Metallization

This process involves the chemical conditioning of a non-conductive surface, typically ABS, ABS/PC, RC 25 Nanocure resin, or HTM140 resin, to enable the application of electrolytic coatings. These coatings serve both decorative and protective purposes.

Proceso en el cual una superficie  no conductora se acondicionan  químicamente para recibir  recubrimientos

Products

ETCHING
REDUCER

Its function is to effectively neutralize hexavalent chromium residues, which are harmful to the next bath in the process.

It is a concentrated liquid mixture that when diluted in water in the presence of hydrochloric acid, acts as a neutralizer of hexavalent chromium from the etching process.

It is a new environmentally friendly product that is biodegradable and free of carcinogenic compounds. Specially formulated to neutralize hexavalent chromium in the presence of hydrochloric acid, it offers a safer and sustainable alternative for the etching process

ACTIVATION

This process deposits palladium onto the plastic surface, enabling the subsequent autocatalytic metal coating.

It is a concentrated liquid colloid developed to activate plastic surfaces as a preliminary step to electroless nickel plating. It features an extremely small particle size, allowing it to penetrate effectively into the micro-cavities created by the etching process.

It is a liquid product specifically formulated to provide the necessary tin for the maintenance and stability of the palladium colloid in activation baths.

ACCELERATION

This process removes tin from the colloid to expose palladium, allowing it to act as a catalyst in the electroless nickel solution.

It is a special blend of biodegradable solid products that, when dissolved in water, prepares the previously activated plastic surface for electroless nickel deposition

It is a liquid blend of biodegradable products, free of oxalates, and water-soluble. It is designed to prepare previously activated plastic surfaces for electroless nickel deposition.

ELECTROLESS NICKEL

This is the final step of the pre-electrolytic process for plastics, where a thin layer of nickel is deposited onto the plastic surface making it conductive for the subsequent acid copper plating.

This process is designed to provide electroless nickel deposits on plastic, creating a highly receptive layer for the subsequent electrolytic finish.

It is formulated for electroless nickel deposition in plastic metallization lines. Being free of ammonium, lead, and cadmium, it is a more environmentally friendly process. This specially designed formulation deposits a nickel-phosphorous layer on ABS or ABS/PC surfaces that have been properly prepared. It offers excellent stability, and with proper handling and adherence to recommended guidelines, its lifespan is virtually indefinite.

CONDITIONER

This process creates a thin copper deposit on the electroless nickel layer, acting as a seal and enhancing the final finish.

It is a liquid concentrate designed for plastic metallization lines, where parts with electroless nickel transition directly to acid copper plating. It improves the current bridge between the rack and the electroless nickel layer while also acting as a sealant for the nickel deposit.

METALIZATION PROCESS DOR 3D-PRINTED PARTS

This process is designed to metallize RC 25 Nanocure and HTM140 resins, which are commonly used in 3D printing machines. 

It is a liquid blend specially formulated to facilitate the metallization of plastic surfaces, such as RC 25 Nanocure and HTM 140, through a micro-etching process. This treatment makes the plastic surface more receptive to metal deposition.

It is a concentrated liquid colloid developed to activate plastic surfaces such as RC 25 Nanocure, HTM140, or other 3D-printed materials as a preliminary step for electroless nickel plating. It has an ultra-fine particle size, allowing it to penetrate effectively into micro-cavities.

It is a special blend of biodegradable solid products that, when dissolved in water, prepares plastic surfaces such as RC 25 Nanocure, HTM140, or other 3D-printed materials for the metallization process.

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