Chemical nickel plating, also known as electroless nickel plating, stands out for its ability to provide a uniform coating, even on parts with complex geometries, including those with hard-to-reach internal surfaces.
This type of coating not only offers an attractive aesthetic appearance but is also characterized by its high hardness, making it an ideal choice for applications requiring wear resistance.
Additionally, its excellent corrosion protection ensures greater durability of treated components, which is essential in harsh environments.Because of these outstanding properties, chemical nickel plating has been widely adopted across various industrial sectors.
For instance, it is used in the manufacture of automotive components where corrosion and wear resistance are crucial for the vehicles performance and safety
It is also used in the electronics industry in order to protect circuits and sensitive components. It is also common in the production of tools and machinery where durability and reliability are essential.
In summary, electroless nickel plating not only enhances the products’ physical properties, but also extends their lifespan and optimizes their performance in various industrial applications.
Products
Electroless Nickel Plating for Printed Circuit Boards
The printed circuit board is a surface composed of conductive tracks laminated into a non-conductive one. It is used to electrically connect the surface on which the components will be assembled.
ACTIVION-C13
It is an ionic activator based on palladium, used in the formation and maintenance of the sensitization solution. It is used in printed circuit boards as an alternative step to electroless nickel plating application.
PREDIP C-40
It is a concentrated product, specially formulated to enhance the adhesion of palladium colloid in the circuit board and to avoid any possible contamination.
ACONDICIONADOR C-27
It is an alkaline mixture specially formulated to prepare and facilitate the coating of fiberglass and to promote the adhesion of the copper layer on the non-conductive material in the circuit boards.
ACTIVADOR PL 52
It is a concentrated liquid colloid formulated to provide the needed amount of colloidal palladium in the nickel metallization process, in circuit boards.
ESTABILIZANTE PL 54
It is a concentrated product specially formulated to provide the necessary tin for the stability, formation and maintenance of the solutions of ACTIVADOR PL.
RECUBPLEX CI-60
It is a special mixture of solid biodegradable products that when dissolved in water prepares the surfaces of the drills, previously activated with the ACTIVADOR PL for the subsequent deposit of electroless nickel, guaranteeing a uniform deposit.
CIRCUIT NI-600
It is specially designed to provide smooth, dense and uniform electroless nickel/phosphorous deposits in printed circuit board drills. It is a stable process, therefore it generates a fine-grained and dense coating with high adhesion. Without metallization failures if the solution is properly maintained.
AUROFILM 22
It is an immersion gold formulated to generate a 24 carat gold layer on printed circuit boards by immersion.
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